The material used in MEMS technology is mainly silicon, but thin films made of other materials are also used, such as germanium and gallium arsenide. MEMS gyroscopes mainly use the following types of materials:
1. Non-metals: silicon, germanium and gallium arsenide
2. Metals: Nickel and Aluminum
3. Polymer: SU8 and polyamide
4. Ceramics: diamond, SiC, SiO2, Si3N4.
There are three properties that need to be focused on during the MEMS production process: elastic, inelastic and strength properties. At the same time, general attention should be paid to some properties, such as dielectric strength, resistivity, thermal conductivity, thermal expansion coefficient, etc.
Elastic properties
Elastic properties are mainly determined by two parameters: Young’s modulus and Poisson’s ratio. Young’s modulus represents the stiffness of a material, while Poisson’s ratio demonstrates the expansion of a material in a direction perpendicular to the direction of compression. Both parameters can be measured using load deflection techniques.
Inelastic properties
Plastic deformation occurs when a material deforms under stress without returning to its original shape. Therefore, it is very important to study the behavior of MEMS materials during inelastic deformation. Fatigue is also an important characteristic because it demonstrates how a MEMS device performs under constant stress or multiple stress cycles. Fatigue characteristics can lead to plastic deformation, which can lead to failure or performance degradation of MEMS devices.
Strength properties
There are several key strength-related properties to consider in MEMS technology, such as tensile strength, fracture strength, flexural strength, and yield strength. These characteristics demonstrate the reliability and robustness of MEMS devices. Optimizing and improving these properties can be enhanced by improving the geometric design.

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